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Номер запчасти изготовителя	количество	цена	серия	упаковка	Статус	Функции	Тип монтажа	Тип	Рабочая Температура	Количество позиций или контактов (сетка)	Прекращение действия	Класс воспламеняемости материала	Материал корпуса	Подача - Спаривание	Контактная отделка — спаривание	Толщина контактного покрытия — сопряжение	Контактный материал – сопряжение	Питч – сообщение	Контактное завершение – сообщение	Толщина контактного покрытия — стойка	Контактный материал – сообщение	Длина терминационного поста	Контактное сопротивление	Текущий рейтинг (А)
211-1-20-003 CONN IC DIP SOCKET 20POS GOLD CnC Tech	1,719 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-55°C ~ 105°C	20 (2 x 10)	Solder	-	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-	-
211-1-28-006 CONN IC DIP SOCKET 28POS GOLD CnC Tech	1,426 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 105°C	28 (2 x 14)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A
210-1-16-003 CONN IC DIP SOCKET 16POS GOLD CnC Tech	1,376 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-40°C ~ 105°C	16 (2 x 8)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A
210-1-20-003 CONN IC DIP SOCKET 20POS GOLD CnC Tech	1,740 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-40°C ~ 105°C	20 (2 x 10)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A
210-1-40-006 CONN IC DIP SOCKET 40POS GOLD CnC Tech	1,005 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-40°C ~ 105°C	40 (2 x 20)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A
211-1-16-003 CONN IC DIP SOCKET 16POS GOLD CnC Tech	3,620 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-55°C ~ 105°C	16 (2 x 8)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A
211-1-32-006 CONN IC DIP SOCKET 32POS GOLD CnC Tech	1,086 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 105°C	32 (2 x 16)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A
211-1-24-006 CONN IC DIP SOCKET 24POS GOLD CnC Tech	1,797 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 105°C	24 (2 x 12)	Solder	-	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-	-
210-1-18-003 CONN IC DIP SOCKET 18POS GOLD CnC Tech	1,264 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-40°C ~ 105°C	18 (2 x 9)	Solder	-	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-	-
210-1-28-006 CONN IC DIP SOCKET 28POS GOLD CnC Tech	2,332 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-40°C ~ 105°C	28 (2 x 14)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.110" (2.78mm)	4mOhm	3 A

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