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IC-разъемы

Номер запчасти изготовителя	количество	цена	серия	упаковка	Статус	Функции	Тип монтажа	Тип	Рабочая Температура	Количество позиций или контактов (сетка)	Прекращение действия	Класс воспламеняемости материала	Материал корпуса	Подача - Спаривание	Контактная отделка — спаривание	Толщина контактного покрытия — сопряжение	Контактный материал – сопряжение	Питч – сообщение	Контактное завершение – сообщение	Толщина контактного покрытия — стойка	Контактный материал – сообщение	Длина терминационного поста	Контактное сопротивление	Текущий рейтинг (А)
69802-132LF CONN SOCKET PLCC 32POS TIN Storage & Server IO (Amphenol Communications Solutions) Спецификация	14,443 In Stock	Active		Tube	Active	Closed Frame	Surface Mount	PLCC	-55°C ~ 125°C	32 (2 x 7, 2 x 9)	Solder	UL94 V-0	Polyphenylene Sulfide (PPS)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	-	20mOhm	1 A
69802-044LF CONN SOCKET PLCC 44POS TIN Storage & Server IO (Amphenol Communications Solutions) Спецификация	5,489 In Stock	Active		Tube	Active	Closed Frame	Surface Mount	PLCC	-55°C ~ 125°C	44 (4 x 11)	Solder	-	Polyphenylene Sulfide (PPS)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	-	-	-
69802-144LF CONN SOCKET PLCC 44POS TIN Storage & Server IO (Amphenol Communications Solutions) Спецификация	17,536 In Stock	Active		Tube	Active	Closed Frame	Surface Mount	PLCC	-55°C ~ 125°C	44 (4 x 11)	Solder	UL94 V-0	Polyphenylene Sulfide (PPS)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	-	20mOhm	1 A
69802-032LF CONN SOCKET PLCC 32POS TIN Storage & Server IO (Amphenol Communications Solutions) Спецификация	3,558 In Stock	Active		Tube	Active	Closed Frame	Surface Mount	PLCC	-55°C ~ 125°C	32 (2 x 7, 2 x 9)	Solder	UL94 V-0	Polyphenylene Sulfide (PPS)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	-	20mOhm	1 A
DILB40P-223TLF CONN IC DIP SOCKET 40POS TIN Storage & Server IO (Amphenol Communications Solutions)	13,303 In Stock	Active		Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 105°C	40 (2 x 20)	Solder	UL94 V-0	Polyamide (PA), Nylon	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	0.124" (3.15mm)	30mOhm	1 A
54020-44030LF CONN SOCKET PLCC 44POS TIN Storage & Server IO (Amphenol Communications Solutions)	5,817 In Stock	Active		Tube	Active	Closed Frame	Through Hole	PLCC	-40°C ~ 105°C	44 (4 x 11)	Solder	-	Polyphenylene Sulfide (PPS)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	-	-	-
DILB32P-223TLF CONN IC DIP SOCKET 32POS TINLEAD Storage & Server IO (Amphenol Communications Solutions)	8,040 In Stock	Active	DILB	Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 125°C	32 (2 x 16)	Solder	UL94 V-0	Polyamide (PA), Nylon	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	0.124" (3.15mm)	30mOhm	1 A
54020-32030LF CONN SOCKET PLCC 32POS TIN Storage & Server IO (Amphenol Communications Solutions)	7,661 In Stock	Active		Tube	Active	Closed Frame	Through Hole	PLCC	-40°C ~ 105°C	32 (2 x 7, 2 x 9)	Solder	UL94 V-0	Polyphenylene Sulfide (PPS)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	0.126" (3.20mm)	20mOhm	1 A
DILB18P-223TLF CONN IC DIP SOCKET 18POS TINLEAD Storage & Server IO (Amphenol Communications Solutions)	10,210 In Stock	Active	DILB	Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-55°C ~ 125°C	18 (2 x 9)	Solder	UL94 V-0	Polyamide (PA), Nylon	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	0.124" (3.15mm)	30mOhm	1 A
DILB24P-224TLF CONN IC DIP SOCKET 24POS TINLEAD Storage & Server IO (Amphenol Communications Solutions) Спецификация	11,182 In Stock	Active	DILB	Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-55°C ~ 125°C	24 (2 x 12)	Solder	-	Polyamide (PA), Nylon	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	-	-	-

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